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Assignee profile:

Xenesys Inc.

City:

Country:

Japan

Published Applications:

4

Last publication date:

2006-03-23

Patent Grants:

4

Last grant date:

2007-06-12

Top Inventors for applications by Xenesys Inc.

These are the the leading inventors for applications assigned to Xenesys Inc.:

Toyoaki Matsuzaki 3 Shizuoka-ken, Japan
Taro WATANABE 1 Tokyo, Japan
Toyoaki Matsuzaki 1 Tagata-Gun, Japan
Toyoaki Matsuzaki 1 Shizuoka, Japan

Shoji Shiba 1 Higashimurayama, Japan
Shoji Shiba 1 Tokyo-To, Japan

Recent patent applications by Xenesys Inc.

Xenesys Inc. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-03-23 ✅ Patent 7,228,893 granted on 2007-06-12

US20060060339A1

Mechanical engineering

Heat exchange unit

#2 | 2005-07-14 ✅ Patent 7,069,982 granted on 2006-07-04

US20050150644A1

Mechanical engineering

Heat transfer member and method for manufacturing same

#3 | 2005-06-23 ✅ Patent 7,022,933 granted on 2006-04-04

US20050133504A1

Performing operations; transporting

Seam welding apparatus

#4 | 2005-01-11 ✅ Patent 6,840,080 granted on 2005-01-11

US10387576

Press-forming apparatus

AssigneeID:

363401 ⎘