Japan
5
2006-12-28
5
2010-12-14
These are the the leading inventors for applications assigned to Ibiden Co., Ltd.:
Ibiden Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Honeycomb structure
#2 | 2006-09-14 ✅ Patent 7,612,295 granted on 2009-11-03Printed wiring board and method for manufacturing the same
#3 | 2006-01-17 ✅ Patent 6,986,917 granted on 2006-01-17Printed wiring board and method of manufacturing the same
#4 | 2005-11-03 ✅ Patent 7,029,379 granted on 2006-04-18Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
#5 | 2005-06-21 ✅ Patent 6,909,054 granted on 2005-06-21Multilayer printed wiring board and method for producing multilayer printed wiring board
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