Maple Plain, Minnesota
United States
6
2008-04-01
6
2008-04-01
These are the the leading inventors for applications assigned to Electrochemicals, Inc.:
Electrochemicals, Inc. based in Maple Plain, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for roughening copper surfaces for bonding to substrates
#2 | 2007-03-06 ✅ Patent 7,186,923 granted on 2007-03-06Printed wiring boards and methods for making them
#3 | 2006-12-26 ✅ Patent 7,153,445 granted on 2006-12-26Method for roughening copper surfaces for bonding to substrates
#4 | 2005-10-27 ✅ Patent 7,108,795 granted on 2006-09-19Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
#5 | 2005-09-20 ✅ Patent 6,946,027 granted on 2005-09-20Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
#6 | 2005-06-16 ✅ Patent 7,211,204 granted on 2007-05-01Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
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