INTERSIL CORPORATION

City:

Milpitas, California

Country:

United States

Published Applications:

Last publication date:

2014-04-24

Patent Grants:

Last grant date:

2014-08-05

Top Inventors for applications by INTERSIL CORPORATION

These are the the leading inventors for applications assigned to INTERSIL CORPORATION:

Michael David Church 2 Sebastian, FL United States
Michael D. Church 2 Sebastian, FL United States
William H. Owen 1 Los Altos Hills, CA United States
Michael D. Church 1 Canyon Lake, FL United States

Dong Zheng 1 San Jose, CA United States
Takeshi Suzuki 1 Tokyo, Japan
Nirmal K. Sharma 1 Fremont, CA United States
Thomas Victorin 1 Palm Bay, FL United States

Bin Wu 1 San Jose, CA United States
Ryo Kamiya 1 Tokyo, Japan
William H. Owen 1 Los Altos, CA United States
ZAKI MOUSSAOUI 1 PALM BAY, FL United States

INTERSIL CORPORATION 1 , United States

Recent patent applications by INTERSIL CORPORATION

INTERSIL CORPORATION based in Milpitas, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2014-04-24 ✅ Patent 8,796,739 granted on 2014-08-05

US20140110819A1

Electricity

Ballasted polycrystalline fuse

#2 | 2013-08-29 ✅ Patent 9,118,831 granted on 2015-08-25

US20130222532A1

Electricity

Image processing apparatus and camera system

#3 | 2012-11-15 ✅ Patent 8,728,875 granted on 2014-05-20

US20120289041A1

Electricity

Ballasted polycrystalline fuse

#4 | 2008-11-13 ✅ Patent 8,101,977 granted on 2012-01-24

US20080277757A1

Electricity

Ballasted polycrystalline fuse

#5 | 2007-01-18 ✅ Patent 7,432,744 granted on 2008-10-07

US20070013415A1

Physics

Comparator circuit with built-in programmable floating gate voltage reference

#6 | 2005-08-16 ✅ Patent 6,931,089 granted on 2005-08-16

US9934632

Phase-locked loop with analog phase rotator

#7 | 2005-07-21 ✅ Patent 7,138,789 granted on 2006-11-21

US20050156579A1

Electricity

Multiphase converter with zero voltage switching

#8 | 2005-03-01 ✅ Patent 6,861,283 granted on 2005-03-01

US10703343

Package for integrated circuit with thermal vias and method thereof

AssigneeID:

36712 ⎘