ASM Assembly Materials Ltd.

City:

Country:

Singapore

Published Applications:

Last publication date:

2006-05-25

Patent Grants:

Last grant date:

2006-10-24

Top Inventors for applications by ASM Assembly Materials Ltd.

These are the the leading inventors for applications assigned to ASM Assembly Materials Ltd.:

Yiu Fai KWAN 1 Hong Kong, Hong Kong
Yiu Fai Kwan 1 Tsuen Wan, Hong Kong
Wai Chan 1 Tin Shui Wai, Hong Kong
Wai CHAN 1 Hong Kong, Hong Kong

Recent patent applications by ASM Assembly Materials Ltd.

ASM Assembly Materials Ltd. based in , SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-05-25 ✅ Patent 7,125,750 granted on 2006-10-24

US20060110855A1

Electricity

Leadframe with enhanced encapsulation adhesion

AssigneeID:

367831 ⎘