Taiwan Semiconductor Manufacturing Co.

City:

Country:

Taiwan

Published Applications:

Last publication date:

2006-08-10

Patent Grants:

Last grant date:

2006-12-26

Top Inventors for applications by Taiwan Semiconductor Manufacturing Co.

These are the the leading inventors for applications assigned to Taiwan Semiconductor Manufacturing Co.:

Yuh-Hwa Chang 1 Shulin City, Taiwan
Steven Lin 1 Shih-chu, Taiwan
Jung-Chin Tsao 1 Taipei, Taiwan
Eugene Chu 1 Cyonglin Township, Hsinchu County, Taiwan

Hsi-Kuei Cheng 1 Jhubei, Taiwan
David Ho 1 Taichung, Taiwan
Eugene Chu 1 Hsinchu, Taiwan
Hsien-Ping Feng 1 Yonghe, Taiwan

Chen-Ming Huang 1 Hsin-Chu, Taiwan
Chi-Wen Liu 1 Hsinchu, Taiwan
Fei-Yuh Chen 1 Hinchu, Taiwan
Yuh-Hwa Chang 1 Shulin, Taiwan

An-Chun Tu 1 Taipei, Taiwan
Hsi-Kuei Cheng 1 Jhubei City, Taiwan
Hsien-Ping Feng 1 Yonghe City, Taiwan
Min-Yuan Cheng 1 Taipei City, Taiwan

David Ho 1 Taichung City, Taiwan
Min-Yuan Cheng 1 Taipei, Taiwan
Jung-Chin Tsao 1 Taipei City, Taiwan

Recent patent applications by Taiwan Semiconductor Manufacturing Co.

Taiwan Semiconductor Manufacturing Co. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-08-10 ✅ Patent 7,153,768 granted on 2006-12-26

US20060177992A1

Performing operations; transporting

Backside coating for MEMS wafer

#2 | 2006-06-29 ✅ Patent 7,256,120 granted on 2007-08-14

US20060141768A1

Electricity

Method to eliminate plating copper defect

#3 | 2005-02-01 ✅ Patent 6,849,546 granted on 2005-02-01

US10700779

Method for improving interlevel dielectric gap filling over semiconductor structures having high aspect ratios

AssigneeID:

369187 ⎘