Osaka
Japan
12
2013-08-29
11
2013-03-12
These are the the leading inventors for applications assigned to Konishi Co., Ltd.:
Konishi Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
METHOD FOR PRODUCING POLYURETHANE PARTICLES
#2 | 2011-05-19 ✅ Patent 8,393,842 granted on 2013-03-12Strip of metallic fasteners adhered to each other
#3 | 2009-10-22 ✅ Patent 8,110,645 granted on 2012-02-07Curable resin composition
#4 | 2008-09-30 ✅ Patent 7,428,802 granted on 2008-09-30Fixing/adjusting tool of plate material
#5 | 2008-05-22 ✅ Patent 7,863,374 granted on 2011-01-04Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive
#6 | 2007-06-12 ✅ Patent 7,230,064 granted on 2007-06-12Process for the preparation of urethane resins and urethane resin compositions
#7 | 2007-05-24 ✅ Patent 7,994,250 granted on 2011-08-09Vinyl-urethane copolymers with intermediary linkage segments having silicon-oxygen bonds and production methods thereof
#8 | 2007-04-24 ✅ Patent 7,208,560 granted on 2007-04-24Process for the preparation of urethane resins and urethane resin compositions
#9 | 2006-08-01 ✅ Patent 7,084,203 granted on 2006-08-01Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive
#10 | 2006-04-04 ✅ Patent 7,022,779 granted on 2006-04-04One-pack moisture-curing epoxy resin composition
#11 | 2005-06-21 ✅ Patent 6,908,654 granted on 2005-06-21Laminate with a peelable top layer and a method of peeling off the top layer from the laminate
#12 | 2005-01-06 ✅ Patent 6,951,677 granted on 2005-10-04Laminate with a peelable top layer and method of peeling off the top layer from the laminate
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