Jiangsu
China
5
2022-03-17
5
2023-11-21
These are the the leading inventors for applications assigned to JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.:
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD. based in Jiangsu, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillars
#2 | 2019-12-19 ✅ Patent 11,217,459 granted on 2022-01-04Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereof
#3 | 2016-12-22 ✅ Patent 9,633,985 granted on 2017-04-25First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof
#4 | 2016-12-22 ✅ Patent 9,640,413 granted on 2017-05-02Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof
#5 | 2016-12-01 ✅ Patent 9,627,303 granted on 2017-04-18Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method
Also check out JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.'s (Jiangsu, China) applicant profile with 5 patent applications submitted.
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