HSP Technologies Inc.

City:

Tsukuba

Country:

Japan

Published Applications:

Last publication date:

2017-08-10

Patent Grants:

Last grant date:

2022-08-02

Top Inventors for applications by HSP Technologies Inc.

These are the the leading inventors for applications assigned to HSP Technologies Inc.:

SHIGEYUKI FUJII 4 NUMAZU-SHI, Japan
Shigeyuki Fujii 4 Numazu, Japan
Akiyoshi Kobayashi 4 Fuji, Japan
Hiroshi SHIMIZU 4 Tsukuba-shi, Japan

Hiroshi Shimizu 4 Tsukuba, Japan
Akiyoshi KOBAYASHI 4 Fuji-shi, Japan
Takafumi SAMESHIMA 3 Mishima-shi, Japan
Takafumi Sameshima 3 Mishima, Japan

Recent patent applications by HSP Technologies Inc.

HSP Technologies Inc. based in Tsukuba, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-08-10 ✅ Patent 11,400,632 granted on 2022-08-02

US20170225360A1

Performing operations; transporting

Extruder screw with conveying portions and barrier portions and extrusion methods using the extruder screw and a plurality of barrel blocks

#2 | 2017-01-26 ✅ Patent 11,400,633 granted on 2022-08-02

US20170021547A1

Performing operations; transporting

Extruder screw passages, extruder and extrusion method

#3 | 2016-11-17 ✅ Patent 11,220,022 granted on 2022-01-11

US20160332332A1

Performing operations; transporting

Extruder screw having paths within the screw, extruder, and extrusion method

#4 | 2016-11-17 ✅ Patent 11,224,991 granted on 2022-01-18

US20160332331A1

Performing operations; transporting

Extruder screw having paths within the screw, extruder, and extrusion method

Also check out HSP Technologies Inc.'s (Tsukuba, Japan) applicant profile with 5 patent applications submitted.

AssigneeID:

369939 ⎘