Lincstech Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2019-11-14

Patent Grants:

Last grant date:

2022-02-01

Top Inventors for applications by Lincstech Co., Ltd.

These are the the leading inventors for applications assigned to Lincstech Co., Ltd.:

Eiichi Shinada 2 Tokyo, Japan
Yuto TANABE 2 Chiyoda-ku, Tokyo, Japan
Eiichi SHINADA 2 Chiyoda-ku, Tokyo, Japan
Yuto Tanabe 2 Tokyo, Japan

Masahiro KATO 2 Chiyoda-ku, Tokyo, Japan
Masahiro Kato 2 Tokyo, Japan

Recent patent applications by Lincstech Co., Ltd.

Lincstech Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-11-14 ✅ Patent 11,240,915 granted on 2022-02-01

US20190350083A1

Electricity

Method for manufacturing multilayer wiring board

#2 | 2019-10-10 ✅ Patent 11,291,124 granted on 2022-03-29

US20190313536A1

Electricity

Method for manufacturing multilayer wiring board

Also check out Lincstech Co., Ltd.'s (Tokyo, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

371669 ⎘