New Taipei
Taiwan
7
2021-11-04
7
2022-04-12
These are the the leading inventors for applications assigned to Comchip Technology Co., Ltd.:
Comchip Technology Co., Ltd. based in New Taipei, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method of manufacturing die package structure
#2 | 2021-08-26 ✅ Patent 11,264,355 granted on 2022-03-01Method of manufacturing die package structure
#3 | 2020-07-23 ✅ Patent 10,777,461 granted on 2020-09-15Method for manufacturing a chip package
#4 | 2020-05-21 ✅ Patent 10,910,268 granted on 2021-02-02Method of manufacturing a chip package
#5 | 2020-05-21 ✅ Patent 10,950,502 granted on 2021-03-16Method of manufacturing a chip package
#6 | 2020-04-02 ✅ Patent 10,937,760 granted on 2021-03-02Method for manufacturing a chip package
#7 | 2020-04-02 ✅ Patent 10,665,509 granted on 2020-05-26Method for manufacturing chip packages
Also check out Comchip Technology Co., Ltd.'s (New Taipei, Taiwan) applicant profile with 7 patent applications submitted.
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