Hakko Corp.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2020-04-30

Patent Grants:

Last grant date:

2021-07-06

Top Inventors for applications by Hakko Corp.

These are the the leading inventors for applications assigned to Hakko Corp.:

Hisao Nemoto 3 Osaka, Japan
Kenta Nakamura 2 Osaka, Japan
Yoshitomo Teraoka 2 Osaka, Japan
Tomoyo Maeshima 2 Osaka, Japan

Mitsuhiko Miyazaki 2 Osaka, Japan
Hiroyuki MASAKI 1 Osaka, Japan
Yokoyama Tetsuo 1 Osaka, Japan
Yasumasa Igi 1 Osaka, Japan

Nobuharu Boh 1 Osaka, Japan
Norihisa Sekimori 1 Osaka, Japan
Kenji Matsuzaki 1 Osaka, Japan
Sanamoto Masashi 1 Osaka, Japan

Recent patent applications by Hakko Corp.

Hakko Corp. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-04-30 ✅ Patent 11,052,479 granted on 2021-07-06

US20200130085A1

Performing operations; transporting

Soldering device control method and apparatus

#2 | 2020-01-30 ✅ Patent 11,273,509 granted on 2022-03-15

US20200030902A1

Performing operations; transporting

Heating tool

#3 | 2019-12-12 ✅ Patent 11,313,733 granted on 2022-04-26

US20190376851A1

Physics

Sensor and sensor assemblies for a thermometer

#4 | 2019-11-07 ✅ Patent 11,316,326 granted on 2022-04-26

US20190341753A1

Electricity

Thermal cartridge device

#5 | 2019-05-09 ✅ Patent 11,059,118 granted on 2021-07-13

US20190134730A1

Performing operations; transporting

Cordless soldering iron

#6 | 2017-06-29 ✅ Patent 9,981,332 granted on 2018-05-29

US20170182576A1

Performing operations; transporting

Holding stand

#7 | 2015-09-24 ✅ Patent 9,497,883 granted on 2016-11-15

US20150271912A1

Electricity

Noise suppression circuit board design for an inductive heater

#8 | 2015-03-26 ✅ Patent 9,931,705 granted on 2018-04-03

US20150083707A1

Performing operations; transporting

Process for fabricating inductive heated solder cartridge

AssigneeID:

374235 ⎘