CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.

City:

Chengdu

Country:

China

Published Applications:

Last publication date:

2021-08-05

Patent Grants:

Last grant date:

2022-11-01

Top Inventors for applications by CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.:

Minghao Shen 2 San Jose, CA United States
Xiaotian Zhou 2 San Jose, CA United States
Chunbin Zhang 1 Fremont, CA United States
Xiaotian Zhou 1 Santa Clara, CA United States

Chunbin Zhang 1 San Jose, CA United States
Shaolin Zou 1 San Jose, CA United States
Minghao Shen 1 Santa Clara, CA United States
Yijiang Hu 1 San Jose, CA United States

Xiaotian ZHOU 1 Fremont, CA United States

Recent patent applications by CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.

CHENGDU ESWIN SIP TECHNOLOGY CO., LTD. based in Chengdu, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-08-05 ✅ Patent 11,488,931 granted on 2022-11-01

US20210242169A1

Electricity

Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same

#2 | 2019-09-26 ✅ Patent 11,177,153 granted on 2021-11-16

US20190295877A1

Electricity

Method of debonding work-carrier pair with thin devices

#3 | 2019-09-12 ✅ Patent 11,274,234 granted on 2022-03-15

US20190276712A1

Chemistry; metallurgy

Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair

#4 | 2019-08-15 ✅ Patent 10,424,524 granted on 2019-09-24

US20190252278A1

Electricity

Multiple wafers fabrication technique on large carrier with warpage control stiffener

Also check out Chengdu ESWIN SiP Technology Co., Ltd.'s (Chengdu, China) applicant profile with 3 patent applications submitted.

AssigneeID:

374310 ⎘