Taipei
Taiwan
7
2020-10-13
7
2020-10-13
These are the the leading inventors for applications assigned to BRIDGE SEMICONDUCTOR CORP.:
BRIDGE SEMICONDUCTOR CORP. based in Taipei, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same
#2 | 2019-06-13 ✅ Patent 11,291,146 granted on 2022-03-29Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same
#3 | 2019-03-26 ✅ Patent 10,242,964 granted on 2019-03-26Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same
#4 | 2019-02-19 ✅ Patent 10,211,067 granted on 2019-02-19Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
#5 | 2019-01-17 ✅ Patent 10,446,526 granted on 2019-10-15Face-to-face semiconductor assembly having semiconductor device in dielectric recess
#6 | 2018-07-19 ✅ Patent 10,269,722 granted on 2019-04-23Wiring board having component integrated with leadframe and method of making the same
#7 | 2018-06-07 ✅ Patent 10,546,808 granted on 2020-01-28Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly
Also check out BRIDGE SEMICONDUCTOR CORP.'s (Taipei, Taiwan) applicant profile with 7 patent applications submitted.
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