FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

City:

Nagano

Country:

Japan

Published Applications:

Last publication date:

2022-09-29

Patent Grants:

Last grant date:

2024-10-08

Top Inventors for applications by FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

These are the the leading inventors for applications assigned to FUJITSU INTERCONNECT TECHNOLOGIES LIMITED:

Daisuke Mizutani 3 Sagamihara, Japan
Toshiki Iwai 3 Atsugi, Japan
Taiji SAKAI 2 Yokohama, Japan
Seigo Yamawaki 1 Nagano, Japan

Hiroshi Nakano 1 Nagano, Japan
Norikazu Ozaki 1 Nagano, Japan
Hiroshi Nakano 1 Nagano-shi, Japan
Manabu WATANABE 1 Yokohama, Japan

Norikazu Ozaki 1 Nagano-shi, Japan
Masateru KOIDE 1 Kawasaki, Japan
Tomoyuki AKAHOSHI 1 Atsugi, Japan
Kei Fukui 1 Iizuna, Japan

Seiki Sakuyama 1 Yamato, Japan
Masaharu Furuyama 1 Fujisawa, Japan

Recent patent applications by FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

FUJITSU INTERCONNECT TECHNOLOGIES LIMITED based in Nagano, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-09-29 ✅ Patent 12,114,433 granted on 2024-10-08

US20220312595A1

Electricity

Substrate, method for manufacturing substrate, and electronic device

#2 | 2020-05-14 ✅ Patent 11,152,291 granted on 2021-10-19

US20200152562A1

Electricity

Multilayer substrate

#3 | 2019-09-19 ✅ Patent 11,057,996 granted on 2021-07-06

US20190289715A1

Electricity

Circuit board, method of manufacturing circuit board, and electronic device

#4 | 2019-02-14 ✅ Patent 11,317,520 granted on 2022-04-26

US20190053385A1

Electricity

Circuit board, method of manufacturing circuit board, and electronic device

#5 | 2019-01-10 ✅ Patent 10,734,316 granted on 2020-08-04

US20190013266A1

Electricity

Wiring board, electronic device, and wiring board manufacturing method

Also check out FUJITSU INTERCONNECT TECHNOLOGIES LIMITED's (Nagano, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

377516 ⎘