Takamatsu
Japan
7
2022-09-15
7
2025-01-07
These are the the leading inventors for applications assigned to AOI Electronics Co., Ltd.:
AOI Electronics Co., Ltd. based in Takamatsu, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Stacked semiconductor devices in sealants and interconnected with pillar electrodes
#2 | 2021-07-15 ✅ Patent 11,521,948 granted on 2022-12-06Method of manufacturing semiconductor device
#3 | 2021-05-13 ✅ Patent 11,075,180 granted on 2021-07-27Semiconductor device and method of manufacturing the semiconductor device
#4 | 2021-03-18 ✅ Patent 11,328,998 granted on 2022-05-10Semiconductor device and manufacturing method of semiconductor device
#5 | 2020-04-23 ✅ Patent 10,953,663 granted on 2021-03-23Thermal head
#6 | 2019-10-24 ✅ Patent 10,854,560 granted on 2020-12-01Semiconductor device and semiconductor device manufacturing method
#7 | 2018-07-12 ✅ Patent 10,854,557 granted on 2020-12-01Semiconductor device packaging with metallic shielding layer
Also check out AOI Electronics Co., Ltd.'s (Takamatsu, Japan) applicant profile with 9 patent applications submitted.
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