Garbsen
Germany
35
2023-08-10
35
2026-05-05
These are the the leading inventors for applications assigned to LPKF LASER & ELECTRONICS AG:
LPKF LASER & ELECTRONICS AG based in Garbsen, DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
DEVICE AND METHOD FOR CELL CULTIVATION
#2 | 2022-12-08 ✅ Patent 12,252,436 granted on 2025-03-18Single-piece reaction vessel made of glass, production method, and analysis method
#3 | 2022-09-15 ✅ Patent 12,030,079 granted on 2024-07-09Device and method for depositing liquid on carriers
#4 | 2022-07-14 ✅ Patent 12,398,066 granted on 2025-08-26METHOD FOR PRODUCING A DISPLAY HAVING A CARRIER SUBSTRATE, A CARRIER SUBSTRATE PRODUCED ACCORDING TO SAID METHOD, AND A COVER GLASS INTENDED FOR A FLEXIBLE DISPLAY
#5 | 2022-07-14 ✅ Patent 12,604,743 granted on 2026-04-14METHOD FOR MAKING A RECESS OR OPENING INTO A PLANAR WORKPIECE USING SUCCESSIVE ETCHING
#6 | 2022-06-30 ✅ Patent 11,377,387 granted on 2022-07-05Method for producing microstructures in a glass substrate
#7 | 2022-03-24 ✅ Patent 11,851,366 granted on 2023-12-26Site-specific connecting of glass substrates
#8 | 2022-03-24 ✅ Patent 12,221,376 granted on 2025-02-11Method for producing a glass-plastic connection
#9 | 2021-11-11 ✅ Patent 11,383,972 granted on 2022-07-12Method for producing microstructures
#10 | 2021-06-24 ✅ Patent 11,613,803 granted on 2023-03-28Use of a component in a composition, composition for laser transfer printing, and laser transfer printing method
#11 | 2021-02-25 ✅ Patent 11,446,879 granted on 2022-09-20Apparatus for joining, in particular laser welding, two components, and operating method for such a joining apparatus
#12 | 2020-09-24 ✅ Patent 11,156,774 granted on 2021-10-26Optical component and method for the production thereof
#13 | 2020-08-20 ✅ Patent 11,515,259 granted on 2022-11-29Method and device for the integration of semiconductor wafers
#14 | 2020-07-30 ✅ Patent 11,505,495 granted on 2022-11-22Method for microstructuring a glass substrate by means of laser radiation
#15 | 2020-06-11 ✅ Patent 11,065,716 granted on 2021-07-20Method for processing, in particular separating, a substrate by means of laser-induced deep reactive etching
#16 | 2020-01-16 ✅ Patent 11,072,041 granted on 2021-07-27Method for producing a technical mask
#17 | 2020-01-09 ✅ Patent 11,478,880 granted on 2022-10-25Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process
#18 | 2018-11-15 ✅ Patent 10,645,814 granted on 2020-05-05Method for creating patterned coatings on a molded article, and device for carrying out said method
#19 | 2017-11-30 ✅ Patent 11,401,194 granted on 2022-08-02Method and device for separating a substrate
#20 | 2017-08-31 ✅ Patent 9,849,692 granted on 2017-12-26Method and apparatus for transferring a printing substance onto a substrate by means of laser radiation
#21 | 2017-06-08 ✅ Patent 10,300,664 granted on 2019-05-28Method and a device for the welding of two parts to be joined made of thermoplastic synthetic materials along a weld seam by means of laser
#22 | 2016-03-03 ✅ Patent 9,764,978 granted on 2017-09-19Method and device for separating a substrate
#23 | 2016-03-03 ✅ Patent 10,610,971 granted on 2020-04-07Method for producing recesses in a substrate
#24 | 2016-02-04 ✅ Patent 9,924,601 granted on 2018-03-20Method for the metallation of a workpiece and a layer structure made up of a workpiece and a metal layer
#25 | 2015-10-15 ✅ Patent 9,676,927 granted on 2017-06-13Core-shell composite inorganic metal oxides and method of preparing for prevention of thermal oxidative degradation in polymer and resin compositions
#26 | 2014-06-05 ✅ Patent 9,610,729 granted on 2017-04-04Device and method for performing and monitoring a plastic laser transmission welding process
#27 | 2013-03-07 ✅ Patent 9,021,691 granted on 2015-05-05Method for introducing electrical insulations in printed circuit boards
#28 | 2013-02-28 ✅ Patent 9,414,499 granted on 2016-08-09Method for partially stripping a defined area of a conductive layer
#29 | 2010-12-23 ✅ Patent 8,314,362 granted on 2012-11-20Device for machining a workpiece by means of parallel laser beams
#30 | 2010-06-10 ✅ Patent 8,415,583 granted on 2013-04-09Clamping apparatus for clamping at least two component parts
#31 | 2007-09-06 ✅ Patent 8,759,710 granted on 2014-06-24Process and device for form locked joining of two components
#32 | 2006-08-24 ✅ Patent 7,559,152 granted on 2009-07-14Method for determining the position of a milling tool and a machining head designed for carrying out the method
#33 | 2006-06-13 ✅ Patent 7,060,421 granted on 2006-06-13Conductor track structures and method for production thereof
#34 | 2006-02-02 ✅ Patent 7,415,927 granted on 2008-08-26Procedure for positioning a through-hole in a substrate
#35 | 2005-08-04 ✅ Patent 7,540,934 granted on 2009-06-02Method and apparatus for irradiation welding of two thermoplastic components
Also check out LPKF Laser & Electronics AG's (Garbsen, Germany) applicant profile with 29 patent applications submitted.
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