CO-TECH DEVELOPMENT CORP.

City:

Taipei

Country:

Taiwan

Published Applications:

Last publication date:

2024-10-24

Patent Grants:

Last grant date:

2026-02-17

Top Inventors for applications by CO-TECH DEVELOPMENT CORP.

These are the the leading inventors for applications assigned to CO-TECH DEVELOPMENT CORP.:

Yun-Hsing Sung 6 Taoyuan, Taiwan
YUN-HSING SUNG 6 Taoyuan City, Taiwan
CHUN-YU KAO 5 Yunlin County, Taiwan
Shih-Shen Lee 3 New Taipei, Taiwan

SHIH-SHEN LEE 3 New Taipei City, Taiwan
Hung-Wei HSU 2 Yun Lin County, Taiwan
ZONG-XIAN WU 1 Yunlin County, Taiwan
HUNG-WEI HSU 1 Yun Lin, Taiwan

Recent patent applications by CO-TECH DEVELOPMENT CORP.

CO-TECH DEVELOPMENT CORP. based in Taipei, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-10-24 ✅ Patent 12,557,213 granted on 2026-02-17

US20240357740A1

Electricity

MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE

#2 | 2021-10-14 ✅ Patent 12,120,816 granted on 2024-10-15

US20210321514A1

Electricity

Micro-roughened electrodeposited copper foil and copper clad laminate

#3 | 2020-12-24 ✅ Patent 11,408,087 granted on 2022-08-09

US20200399776A1

Chemistry; metallurgy

Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same

#4 | 2020-05-07 ✅ Patent 11,186,918 granted on 2021-11-30

US20200141017A1

Chemistry; metallurgy

Micro-roughened electrodeposited copper foil and copper clad laminate using the same

#5 | 2020-03-26 ✅ Patent 11,047,061 granted on 2021-06-29

US20200095701A1

Chemistry; metallurgy

Micro-roughened electrodeposited copper foil and copper foil substrate

#6 | 2020-03-19 ✅ Patent 11,053,602 granted on 2021-07-06

US20200087811A1

Chemistry; metallurgy

Micro-roughened electrodeposited copper foil and copper foil substrate

Also check out CO-TECH DEVELOPMENT CORP.'s (Taipei, Taiwan) applicant profile with 6 patent applications submitted.

AssigneeID:

384037 ⎘