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Assignee profile:

DAISO CO., LTD.

City:

Osaka-shi

Country:

Japan

Published Applications:

16

Last publication date:

2013-09-12

Patent Grants:

15

Last grant date:

2016-08-02

Top Inventors for applications by DAISO CO., LTD.

These are the the leading inventors for applications assigned to DAISO CO., LTD.:

Recent patent applications by DAISO CO., LTD.

DAISO CO., LTD. based in Osaka-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2013-09-12 ✅ Patent 9,404,022 granted on 2016-08-02
US20130236670A1
Chemistry; metallurgy

Composition for vulcanizing adhesion

 #2 | 2012-08-16 ✅ Patent 8,735,503 granted on 2014-05-27
US20120208966A1
Physics

Composition for semiconductive rubber, crosslinked rubber product, and semiconductive parts

 #3 | 2012-01-19 ✅ Patent 8,648,190 granted on 2014-02-11
US20120016120A1
Chemistry; metallurgy

Process for producing 2-hydroxymethylmorpholine salt

 #4 | 2011-11-24
US20110288315A1
Chemistry; metallurgy

PROCESS FOR PRODUCTION OF OPTICALLY ACTIVE COMPOUND

 #5 | 2011-09-01 ✅ Patent 8,871,118 granted on 2014-10-28
US20110210296A1
Chemistry; metallurgy

Semi-conductive rubber composition and vulcanizate thereof

 #6 | 2011-06-30 ✅ Patent 8,835,566 granted on 2014-09-16
US20110160344A1
Chemistry; metallurgy

Rubber composition for vulcanization

 #7 | 2011-06-30 ✅ Patent 8,530,587 granted on 2013-09-10
US20110160342A1
Chemistry; metallurgy

Vulcanizable rubber composition for use in an air spring and rubber formed product for use in an air spring

 #8 | 2010-11-25 ✅ Patent 8,492,000 granted on 2013-07-23
US20100297452A1
Mechanical engineering

Vulcanized rubber laminate

 #9 | 2010-11-04 ✅ Patent 8,197,658 granted on 2012-06-12
US20100276280A1
Chemistry; metallurgy

Hollow electrode with film for electrodeposition coating

 #10 | 2010-02-04 ✅ Patent 8,226,805 granted on 2012-07-24
US20100025254A1
Chemistry; metallurgy

Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same

 #11 | 2009-11-05 ✅ Patent 7,943,019 granted on 2011-05-17
US20090272646A1
Chemistry; metallurgy

Insoluble electrode

 #12 | 2008-11-06 ✅ Patent 7,569,083 granted on 2009-08-04
US20080271847A1
Electricity

Gas diffusion electrode assembly, bonding method for gas diffusion electrodes, and electrolyzer comprising gas diffusion electrodes

 #13 | 2008-10-09 ✅ Patent 7,537,703 granted on 2009-05-26
US20080249326A1
Performing operations; transporting

High-endurance packing material for liquid chromatography

 #14 | 2006-09-28 ✅ Patent 8,283,039 granted on 2012-10-09
US20060216518A1
Mechanical engineering

Vulcanized rubber laminate

 #15 | 2006-06-15 ✅ Patent 8,258,222 granted on 2012-09-04
US20060128857A1
Chemistry; metallurgy

Composition for vulcanized rubber and vulcanization product

 #16 | 2006-01-26 ✅ Patent 7,247,468 granted on 2007-07-24
US20060019359A1
Chemistry; metallurgy

Method for producing optically active 1,2-diols by microorganism culturing

Also check out DAISO CO., LTD.'s (Osaka-shi, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

38560 ⎘