LOTUS THERMAL SOLUTION INC.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2024-07-11

Patent Grants:

Last grant date:

2026-05-19

Top Inventors for applications by LOTUS THERMAL SOLUTION INC.

These are the the leading inventors for applications assigned to LOTUS THERMAL SOLUTION INC.:

Masaaki Murakami 2 Osaka, Japan
Takuya Ide 2 Osaka, Japan
Takuya IDE 2 Osaka-shi, Japan
Tomiyuki NUMATA 2 Osaka-shi, Japan

Tomiyuki Numata 2 Osaka, Japan
Masaaki MURAKAMI 2 Osaka-shi, Japan

Recent patent applications by LOTUS THERMAL SOLUTION INC.

LOTUS THERMAL SOLUTION INC. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-07-11 ✅ Patent 12,635,112 granted on 2026-05-19

US20240237290A1

Electricity

HEAT SINK STRUCTURE

#2 | 2021-09-02 ✅ Patent 11,510,337 granted on 2022-11-22

US20210274679A1

Electricity

Fan-equipped heatsink

Also check out Lotus Thermal Solution Inc.'s (Osaka, Japan) applicant profile with 2 patent applications submitted.

AssigneeID:

390586 ⎘