Tessonics, Inc.

City:

Windsor

Country:

Canada

Published Applications:

Last publication date:

2018-02-22

Patent Grants:

Last grant date:

2022-12-20

Top Inventors for applications by Tessonics, Inc.

These are the the leading inventors for applications assigned to Tessonics, Inc.:

Roman Gr. Maev 1 Windsor, Canada
Volf Leshchynsky 1 Windsor, Canada
Damir Ziganshin 1 Windsor, Canada
Dmitriy Jurievich Gavrilov 1 Windsor, Canada

Dmitry Dzhurinskiy 1 Windsor, Canada
Raymond Belenkov 1 Windsor, Canada
Emil Strumban 1 West Bloomfield, MI United States

Recent patent applications by Tessonics, Inc.

Tessonics, Inc. based in Windsor, CA has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-02-22 ✅ Patent 11,529,681 granted on 2022-12-20

US20180050391A1

Performing operations; transporting

3D printing method of forming a bulk solid structure element by cold spray

Also check out Tessonics, Inc.'s (Windsor, Canada) applicant profile with 3 patent applications submitted.

AssigneeID:

391822 ⎘