Chip Pac, Inc.

City:

Fremont, California

Country:

United States

Published Applications:

Last publication date:

2006-08-03

Patent Grants:

Last grant date:

2007-01-16

Top Inventors for applications by Chip Pac, Inc.

These are the the leading inventors for applications assigned to Chip Pac, Inc.:

Marcos Karnezos 1 Palo Alto, CA United States

Recent patent applications by Chip Pac, Inc.

Chip Pac, Inc. based in Fremont, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-08-03 ✅ Patent 7,163,842 granted on 2007-01-16

US20060172459A1

Electricity

Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)

AssigneeID:

393027 ⎘