Sakuratech Co. Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2006-06-29

Patent Grants:

Last grant date:

2009-10-13

Top Inventors for applications by Sakuratech Co. Ltd.

These are the the leading inventors for applications assigned to Sakuratech Co. Ltd.:

Tomio Kitsuwa 2 Osaka, Japan

Recent patent applications by Sakuratech Co. Ltd.

Sakuratech Co. Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-06-29 ✅ Patent 7,601,433 granted on 2009-10-13

US20060141280A1

Chemistry; metallurgy

Highly corrosion-resistant/highly workable plated steel wire, plating bath composition, method for producing the plated steel wire and wire netting product

#2 | 2005-05-19 ✅ Patent 7,220,316 granted on 2007-05-22

US20050103263A1

Chemistry; metallurgy

Wire material plating equipment

AssigneeID:

396180 ⎘