Mutual-Pak Technology Co. Ltd.

City:

Country:

Taiwan

Published Applications:

Last publication date:

2007-03-01

Patent Grants:

Last grant date:

2007-09-25

Top Inventors for applications by Mutual-Pak Technology Co. Ltd.

These are the the leading inventors for applications assigned to Mutual-Pak Technology Co. Ltd.:

Lu-Chen Hwan 1 Taipei, Taiwan

Recent patent applications by Mutual-Pak Technology Co. Ltd.

Mutual-Pak Technology Co. Ltd. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-03-01 ✅ Patent 7,273,768 granted on 2007-09-25

US20070048901A1

Electricity

Wafer-level package and IC module assembly method for the wafer-level package

AssigneeID:

399382 ⎘