Minneapolis, Minnesota
United States
7
2011-10-20
7
2014-01-21
These are the the leading inventors for applications assigned to Hysitron, Inc.:
Hysitron, Inc. based in Minneapolis, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Indenter assembly
#2 | 2011-01-13 ✅ Patent 8,453,498 granted on 2013-06-04Actuatable capacitive transducer for quantitative nanoindentation combined with transmission electron microscopy
#3 | 2007-08-09 ✅ Patent 7,798,011 granted on 2010-09-21Actuatable capacitive transducer for quantitative nanoindentation combined with transmission electron microscopy
#4 | 2006-08-31 ✅ Patent 7,287,419 granted on 2007-10-30Method of measuring interfacial adhesion properties of stents
#5 | 2006-06-29 ✅ Patent 7,287,420 granted on 2007-10-30Method of measuring properties of interfacial adhesion of medical device coatings
#6 | 2006-06-29 ✅ Patent 7,287,418 granted on 2007-10-30Method of measuring interfacial adhesion properties of electronic structures
#7 | 2006-06-29 ✅ Patent 7,628,065 granted on 2009-12-08Method of measuring properties of interfacial adhesion
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