Assignee profile:

JF Microtechnology Sdn. Bhd.

City:

Petaling Jaya

Country:

Malaysia

Published Applications:

27

Last publication date:

2026-03-12

Patent Grants:

20

Last grant date:

2026-05-05

Top Inventors for applications by JF Microtechnology Sdn. Bhd.

These are the the leading inventors for applications assigned to JF Microtechnology Sdn. Bhd.:

Recent patent applications by JF Microtechnology Sdn. Bhd.

JF Microtechnology Sdn. Bhd. based in Petaling Jaya, MY has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-03-12
US20260072077A1
Physics

TEST CONTACT FOR A PIN-TYPE DEVICE WITH A SQUARE OR ROUND CROSS-SECTION

#2 | 2024-08-22
US20240280607A1
Physics

ELECTRICAL TEST CONTACT TERMINAL FOR A PIN-TYPE DEVICE LEAD

#3 | 2024-05-16
US20240159796A1
Physics

SPRING CONTACT IN A TESTING APPARATUS FOR INTEGRATED CIRCUITS

#4 | 2023-10-05 ✅ Patent 12,618,899 granted on 2026-05-05
US20230314501A1
Physics

METHOD FOR ALIGNING CONTACT PINS IN AN INTEGRATED CIRCUIT TESTING APPARATUS

#5 | 2022-12-08 ✅ Patent 11,674,977 granted on 2023-06-13
US20220390488A1
Physics

Short interconnect assembly with strip elastomer

#6 | 2022-10-06 ✅ Patent 11,821,916 granted on 2023-11-21
US20220317152A1
Physics

Ground connector in an integrated circuit testing apparatus

#7 | 2022-05-12 ✅ Patent 11,696,396 granted on 2023-07-04
US20220151063A1
Electricity

Short interconnect assembly with strip elastomer

#8 | 2021-12-16 ✅ Patent 11,266,015 granted on 2022-03-01
US20210392746A1
Electricity

Short interconnect assembly with strip elastomer

#9 | 2020-12-17
US20200393511A1
Physics

WEDGED CONTACT FINGERS FOR INTEGRATED CIRCUIT TESTING APPARATUS

#10 | 2020-02-27
US20200064371A1
Physics

SHORT CONTACT WITH MULTIFUNCTIONAL ELASTOMER

#11 | 2019-08-29 ✅ Patent 10,826,217 granted on 2020-11-03
US20190267738A1
Electricity

Horizontal clamp electrical contact assembly

#12 | 2019-02-28
US20190067861A1
Electricity

LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY

#13 | 2019-02-28 ✅ Patent 10,830,812 granted on 2020-11-10
US20190064260A1
Physics

Low inductance electrical contact assembly manufacturing process

#14 | 2018-11-22
US20180337505A1
Electricity

MANUFACTURING PROCESS FOR KELVIN CONTACT ASSEMBLY HOUSING

#15 | 2018-11-22 ✅ Patent 10,466,300 granted on 2019-11-05
US20180335473A1
Physics

High precision vertical motion kelvin contact assembly

#16 | 2018-11-15 ✅ Patent 10,488,439 granted on 2019-11-26
US20180328963A1
Physics

Compressible layer with integrated bridge in IC testing apparatus

#17 | 2018-11-01 ✅ Patent 10,578,645 granted on 2020-03-03
US20180313869A1
Physics

Short contact with multifunctional elastomer

#18 | 2017-08-24 ✅ Patent 10,446,965 granted on 2019-10-15
US20170244189A1
Electricity

Spring contact in a testing apparatus for integrated circuits

#19 | 2017-08-24 ✅ Patent 10,527,646 granted on 2020-01-07
US20170242055A1
Physics

Kelvin contact assembly and method of installation thereof

#20 | 2017-08-03 ✅ Patent 10,018,653 granted on 2018-07-10
US20170219624A1
Physics

Kelvin contact assembly in a testing apparatus for integrated circuits

#21 | 2016-06-23 ✅ Patent 9,658,253 granted on 2017-05-23
US20160178692A1
Physics

Contact assembly in a testing apparatus for integrated circuits

#22 | 2016-03-17 ✅ Patent 10,018,652 granted on 2018-07-10
US20160079707A1
Electricity

Short contact in a testing apparatus for wireless integrated circuits

#23 | 2015-07-30 ✅ Patent 9,140,721 granted on 2015-09-22
US20150212111A1
Physics

Electrical interconnect assembly

#24 | 2015-06-18 ✅ Patent 10,031,163 granted on 2018-07-24
US20150168451A1
Physics

Compressible layer with integrated bridge in IC testing apparatus

#25 | 2014-05-08 ✅ Patent 8,952,714 granted on 2015-02-10
US20140127953A1
Electricity

Electrical interconnect assembly

#26 | 2014-04-17 ✅ Patent 9,658,248 granted on 2017-05-23
US20140103952A1
Physics

Ground contact of an integrated circuit testing apparatus

#27 | 2013-09-26 ✅ Patent 9,182,424 granted on 2015-11-10
US20130249583A1
Physics

Multiple rigid contact solution for IC testing

Also check out JF MICROTECHNOLOGY SDN. BHD.'s (Petaling Jaya, Malaysia) applicant profile with 3 patent applications submitted.

AssigneeID:

40192 ⎘