Toray Engineering Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2006-04-27

Patent Grants:

Last grant date:

2009-09-22

Top Inventors for applications by Toray Engineering Co., Ltd.

These are the the leading inventors for applications assigned to Toray Engineering Co., Ltd.:

Akira Yamauchi 5 Shiga, Japan
Hiromitu Wada 1 Kusatu, Japan
Masanori Akita 1 Otsu, Japan
Yoshiyuki Arai 1 Shiga, Japan

Tadatomo Suga 1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan
Toshihiro ITO 1 Tokyo, Japan
Toshihiro Mori 1 Shiga, Japan
Yosuke Sagami 1 Kanagawa, Japan

Tadatomo Suga 1 Tokyo, Japan
Kenji Sato 1 Moriyama, Japan
Koichi Mimura 1 Otsu, Japan
Fujio Murai 1 Yokaichi, Japan

Katsumi Terada 1 Shiga, Japan

Recent patent applications by Toray Engineering Co., Ltd.

Toray Engineering Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-04-27 ✅ Patent 7,591,293 granted on 2009-09-22

US20060085965A1

Electricity

Device for bonding a metal on a surface of a substrate

#2 | 2006-02-07 ✅ Patent 6,993,832 granted on 2006-02-07

US10469299

Chip mounting device

#3 | 2005-11-08 ✅ Patent 6,961,994 granted on 2005-11-08

US10221142

Method of high-speed and accurate alignment using a chip mounting device

#4 | 2005-07-05 ✅ Patent 6,913,945 granted on 2005-07-05

US10450837

Method of mounting a chip

#5 | 2005-05-19 ✅ Patent 7,341,877 granted on 2008-03-11

US20050104230A1

Electricity

Calibration method in a chip mounting device

#6 | 2005-02-22 ✅ Patent 6,859,053 granted on 2005-02-22

US10111102

Probe apparatus manufacturing method thereof and substrate inspecting method using the same

AssigneeID:

403708 ⎘