VIA Technologies, Inc.

City:

Tapei

Country:

Taiwan

Published Applications:

Last publication date:

2007-05-17

Patent Grants:

Last grant date:

2009-04-07

Top Inventors for applications by VIA Technologies, Inc.

These are the the leading inventors for applications assigned to VIA Technologies, Inc.:

Wen-Yuan Chang 1 Taipei, Taiwan
Daniel Ho 1 Palo Alto, CA United States

Recent patent applications by VIA Technologies, Inc.

VIA Technologies, Inc. based in Tapei, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-05-17 ✅ Patent 7,514,966 granted on 2009-04-07

US20070109026A1

Electricity

Fast, low offset ground sensing comparator

#2 | 2007-04-12 ✅ Patent 7,372,169 granted on 2008-05-13

US20070080456A1

Electricity

Arrangement of conductive pads on grid array package and on circuit board

AssigneeID:

405501 ⎘