Lafayette, California
United States
8
2015-10-06
8
2015-10-06
These are the the leading inventors for applications assigned to Micro Processing Technology, Inc.:
Micro Processing Technology, Inc. based in Lafayette, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
System for separating devices from a semiconductor wafer
#2 | 2014-12-09 ✅ Patent 8,906,745 granted on 2014-12-09Method using fluid pressure to remove back metal from semiconductor wafer scribe streets
#3 | 2013-05-28 ✅ Patent 8,450,188 granted on 2013-05-28Method of removing back metal from an etched semiconductor scribe street
#4 | 2012-07-17 ✅ Patent 8,220,685 granted on 2012-07-17System for breaking a semiconductor wafer or other workpiece along a scribe line
#5 | 2010-10-05 ✅ Patent 7,807,479 granted on 2010-10-05Method and apparatus for improving force control in wafer scribing
#6 | 2007-01-23 ✅ Patent 7,165,331 granted on 2007-01-23Apparatus and method for scribing a semiconductor wafer while controlling scribing forces
#7 | 2006-07-27 ✅ Patent 7,415,916 granted on 2008-08-26Scribing system with particle remover
#8 | 2006-07-27 ✅ Patent 7,392,732 granted on 2008-07-01Scribing tool and method
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