Research Triangle Park, North Carolina
United States
11
2015-06-25
11
2017-08-29
These are the the leading inventors for applications assigned to Microelectronics Assembly Technologies, Inc.:
Microelectronics Assembly Technologies, Inc. based in Research Triangle Park, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Rigid circuit board with flexibly attached module
#2 | 2014-04-17 ✅ Patent 8,899,994 granted on 2014-12-02Compression connector system
#3 | 2014-04-17 ✅ Patent 8,817,458 granted on 2014-08-26Flexible circuit board and connection system
#4 | 2011-05-19 ✅ Patent 8,559,181 granted on 2013-10-15Thin multi-chip flex module
#5 | 2009-07-02 ✅ Patent 8,345,431 granted on 2013-01-01Thin multi-chip flex module
#6 | 2009-07-02 ✅ Patent 7,796,399 granted on 2010-09-14Thin multi-chip flex module
#7 | 2009-07-02 ✅ Patent 7,724,530 granted on 2010-05-25Thin multi-chip flex module
#8 | 2007-09-13 ✅ Patent 7,393,226 granted on 2008-07-01Thin multichip flex-module
#9 | 2007-09-13 ✅ Patent 7,429,788 granted on 2008-09-30Thin multichip flex-module
#10 | 2007-09-13 ✅ Patent 7,394,149 granted on 2008-07-01Thin multichip flex-module
#11 | 2007-09-13 ✅ Patent 7,787,254 granted on 2010-08-31Thin multichip flex-module
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