Japan
4
2009-01-06
4
2009-01-06
These are the the leading inventors for applications assigned to Enplas Corporation:
Enplas Corporation based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Microfluid handling device
#2 | 2008-08-05 ✅ Patent 7,406,891 granted on 2008-08-05Injection molded resin gear and injection molded resin rotating body
#3 | 2006-11-16 ✅ Patent 7,670,561 granted on 2010-03-02Micro fluidic device and joint therefor
#4 | 2005-07-28 ✅ Patent 7,406,892 granted on 2008-08-05Plastic molded gear, and intermittent rotation transmission device and gear train using same
407715 ⎘