San-ei Kagaku Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2008-07-08

Patent Grants:

Last grant date:

2008-07-08

Top Inventors for applications by San-ei Kagaku Co., Ltd.

These are the the leading inventors for applications assigned to San-ei Kagaku Co., Ltd.:

Kazunori KITAMURA 2 Tokyo, Japan
Kiyoshi Sato 2 Tokyo, Japan

Recent patent applications by San-ei Kagaku Co., Ltd.

San-ei Kagaku Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-07-08 ✅ Patent 7,396,885 granted on 2008-07-08

US10241459

Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board

#2 | 2005-01-27 ✅ Patent 7,410,673 granted on 2008-08-12

US20050019582A1

Electricity

Smooth board and process for preparing a smooth board

AssigneeID:

407963 ⎘