Assignee profile:

Advanced Semiconductor Engineering Inc.

City:

Pingtung

Country:

Taiwan

Published Applications:

10

Last publication date:

2009-10-08

Patent Grants:

10

Last grant date:

2012-09-25

Top Inventors for applications by Advanced Semiconductor Engineering Inc.

These are the the leading inventors for applications assigned to Advanced Semiconductor Engineering Inc.:

Recent patent applications by Advanced Semiconductor Engineering Inc.

Advanced Semiconductor Engineering Inc. based in Pingtung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-10-08 ✅ Patent 8,273,445 granted on 2012-09-25
US20090252931A1
Electricity

Reinforced assembly carrier

#2 | 2009-10-08 ✅ Patent 8,099,865 granted on 2012-01-24
US20090249618A1
Electricity

Method for manufacturing a circuit board having an embedded component therein

#3 | 2009-09-17 ✅ Patent 7,955,897 granted on 2011-06-07
US20090230564A1
Electricity

Chip structure and stacked chip package as well as method for manufacturing chip structures

#4 | 2009-08-27 ✅ Patent 7,651,888 granted on 2010-01-26
US20090215228A1
Performing operations; transporting

Wafer lever fixture and method for packaging micro-electro-mechanical-system devices

#5 | 2009-02-19 ✅ Patent 7,863,181 granted on 2011-01-04
US20090047782A1
Electricity

Method for manufacturing a device having a high aspect ratio via

#6 | 2009-02-19 ✅ Patent 7,706,149 granted on 2010-04-27
US20090046436A1
Performing operations; transporting

Micro-electro-mechanical-system package and method for manufacturing the same

#7 | 2008-12-11 ✅ Patent 7,501,342 granted on 2009-03-10
US20080303167A1
Electricity

Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same

#8 | 2008-09-25 ✅ Patent 7,681,779 granted on 2010-03-23
US20080230587A1
Performing operations; transporting

Method for manufacturing electric connections in wafer

#9 | 2008-08-07 ✅ Patent 8,072,081 granted on 2011-12-06
US20080185699A1
Performing operations; transporting

Microelectromechanical system package

#10 | 2005-05-05 ✅ Patent 7,425,755 granted on 2008-09-16
US20050093177A1
Electricity

Semiconductor package, method for manufacturing the same and lead frame for use in the same

AssigneeID:

408911 ⎘