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Assignee profile:

Besi Switzerland AG

City:

Cham

Country:

Switzerland

Published Applications:

Last publication date:

2023-09-07

Patent Grants:

Last grant date:

2024-03-05

Top Inventors for applications by Besi Switzerland AG

These are the the leading inventors for applications assigned to Besi Switzerland AG:

Andreas Mayr 5 Wiesing, Austria
Hannes Kostner 4 Absam, Austria
Hugo Pristauz 4 St. Johann i. Tirol, Austria
Norbert Bilewicz 3 Vomp, Austria

Hubert Selhofer 3 Innsbruck, Austria
Florian Speer 3 Worgl, Austria
Ernst Barmettler 2 Emmenbrucke, Switzerland
Dietmar Lackner 2 Soll, Austria

Martin Widauer 2 Worgl, Austria
Heinrich Berchtold 2 Luzern, Switzerland
Daniel Andreas Scherer 1 Birmensdorf, Switzerland
Paul Andreas Stadler 1 Rotkreuz, Switzerland

Brian Pulis 1 Knonau, Switzerland
Christof Koster 1 Allenwinden, Switzerland
Irving Rodriguez 1 Hermetschwil, Switzerland
Fabian Hurschler 1 Lucerne, Switzerland

Harald Meixner 1 Buch, Austria
Fabian Hurschler 1 Luzern, Switzerland
Christoffer Stroemberg 1 Luzern, Switzerland
Kevin Domancich 1 Knonau, Switzerland

Guido Suter 1 Geuensee, Switzerland
Charles Galea 1 Knonau, Switzerland
Rene Betschart 1 Schwyz, Switzerland
Reto Weibel 1 Hunenberg, Switzerland

Ruedi Grueter 1 Buttisholz, Switzerland

Recent patent applications by Besi Switzerland AG

Besi Switzerland AG based in Cham, CH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-09-07 ✅ Patent 11,924,974 granted on 2024-03-05

US20230284426A1

Electricity

Apparatus for mounting components on a substrate

#2 | 2021-06-24 ✅ Patent 11,696,429 granted on 2023-07-04

US20210195816A1

Electricity

Apparatus and method for mounting components on a substrate

#3 | 2018-11-01 ✅ Patent 10,973,158 granted on 2021-04-06

US20180317353A1

Electricity

Apparatus and method for mounting components on a substrate

#4 | 2017-03-02 ✅ Patent 9,721,819 granted on 2017-08-01

US20170062257A1

Electricity

Method for mounting semiconductors provided with bumps on substrate locations of a substrate

#5 | 2016-06-16 ✅ Patent 9,956,692 granted on 2018-05-01

US20160167237A1

Performing operations; transporting

Kinematic holding system for a placement head of a placement apparatus

#6 | 2015-05-21 ✅ Patent 9,666,460 granted on 2017-05-30

US20150136836A1

Electricity

Through type furnace for substrates comprising a longitudinal slit

#7 | 2015-01-08 ✅ Patent 9,889,516 granted on 2018-02-13

US20150008249A1

Performing operations; transporting

Device for dispensing and distributing flux-free solder on a substrate

#8 | 2014-10-23

US20140311652A1

Electricity

Method And Apparatus For Mounting Electronic Or Optical Components On A Substrate

#9 | 2014-10-16 ✅ Patent 9,233,389 granted on 2016-01-12

US20140305372A1

Performing operations; transporting

Device for dispensing adhesive on a substrate

#10 | 2014-07-24 ✅ Patent 8,925,608 granted on 2015-01-06

US20140202636A1

Electricity

Bonding head with a heatable and coolable suction member

#11 | 2014-07-17 ✅ Patent 9,240,334 granted on 2016-01-19

US20140196853A1

Electricity

Method for detaching a semiconductor chip from a foil

#12 | 2014-06-26

US20140175159A1

Electricity

Thermocompression Bonding Method And Apparatus For Mounting Semiconductor Chips On A Substrate

#13 | 2014-01-30 ✅ Patent 9,364,953 granted on 2016-06-14

US20140030052A1

Performing operations; transporting

Kinematic holding system for a placement head of a placement apparatus

#14 | 2014-01-09 ✅ Patent 9,339,885 granted on 2016-05-17

US20140008421A1

Performing operations; transporting

Method and apparatus for dispensing flux-free solder on a substrate

#15 | 2013-10-03 ✅ Patent 9,039,867 granted on 2015-05-26

US20130255889A1

Electricity

Method for detaching a semiconductor chip from a foil

Also check out Besi Switzerland AG's (Cham, Switzerland) applicant profile with 14 patent applications submitted.

AssigneeID:

40933 ⎘