Japan
11
2010-06-03
11
2014-05-06
These are the the leading inventors for applications assigned to Lintec Corporation:
Lintec Corporation based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor chip laminate and adhesive composition for semiconductor chip lamination
#2 | 2010-05-06 ✅ Patent 8,252,401 granted on 2012-08-28Release sheet and pressure-sensitive adhesive article
#3 | 2007-07-12 ✅ Patent 7,498,947 granted on 2009-03-03Antenna circuit, IC inlet, multi tag, and method for producing multi tag
#4 | 2006-10-26 ✅ Patent 7,434,739 granted on 2008-10-14Antenna circuit, IC inlet, IC tag, and IC card, as well as manufacturing method of IC tag and manufacturing method of IC card
#5 | 2006-10-05 ✅ Patent 7,803,452 granted on 2010-09-28Release film
#6 | 2006-09-28 ✅ Patent 7,897,229 granted on 2011-03-01Release sheet and pressure-sensitive adhesive article
#7 | 2006-02-28 ✅ Patent 7,005,183 granted on 2006-02-28Application sheet used for pressure-sensitive adhesive sheet for painting
#8 | 2005-07-19 ✅ Patent 6,919,262 granted on 2005-07-19Process for producing semiconductor chips
#9 | 2005-05-03 ✅ Patent 6,887,557 granted on 2005-05-03Anti-static hard coat film and method of manufacturing the same
#10 | 2005-02-08 ✅ Patent 6,853,286 granted on 2005-02-08Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag
#11 | 2005-01-18 ✅ Patent 6,844,859 granted on 2005-01-18Loop antenna, loop antenna system and wireless communication system
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