Konishi Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2011-08-18

Patent Grants:

Last grant date:

2012-06-12

Top Inventors for applications by Konishi Co., Ltd.

These are the the leading inventors for applications assigned to Konishi Co., Ltd.:

SHINICHI SATO 4 SAITAMA, Japan
Yukihiro Nomura 3 Saitama, Japan
Shinichi Sato 2 Saitama-shi, Japan
Shigeki Mori 2 Osaka, Japan

Jun Inui 2 Saitama, Japan
Kazuhiro Iyo 2 Osaka, Japan
Yukihiro Nomura 2 Saitama-shi, Japan
Manabu Hashimoto 1 Osaka, Japan

Kazuhiro Iyo 1 Osaka-shi, Japan
Takashi Kida 1 Osaka, Japan
Hiroyuki Fujimoto 1 Saitama, Japan
Jun Inui 1 Saitama-shi, Japan

Shigeki Mori 1 Osaka-shi, Japan

Recent patent applications by Konishi Co., Ltd.

Konishi Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-08-18 ✅ Patent 8,197,896 granted on 2012-06-12

US20110200746A1

Chemistry; metallurgy

Method for producing a pressure-sensitive adhesive tape or sheet

#2 | 2009-10-22 ✅ Patent 8,110,645 granted on 2012-02-07

US20090264602A1

Chemistry; metallurgy

Curable resin composition

#3 | 2006-08-24 ✅ Patent 7,576,167 granted on 2009-08-18

US20060189736A1

Chemistry; metallurgy

Curable resin composition

#4 | 2006-04-13 ✅ Patent 7,449,519 granted on 2008-11-11

US20060079605A1

Chemistry; metallurgy

Curing resin, method for producing same and curing resin composition

AssigneeID:

410469 ⎘