Assignee profile:

Headway Technologies, Inc.

City:

Milpitas

Country:

un

Published Applications:

17

Last publication date:

2019-05-21

Patent Grants:

17

Last grant date:

2019-05-21

Top Inventors for applications by Headway Technologies, Inc.

These are the the leading inventors for applications assigned to Headway Technologies, Inc.:

Recent patent applications by Headway Technologies, Inc.

Headway Technologies, Inc. based in Milpitas, un has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-05-21 ✅ Patent 10,297,277 granted on 2019-05-21
US16123225
Physics

Magnetic head including a coil and a magnetic path forming section

#2 | 2017-04-11 ✅ Patent 9,620,153 granted on 2017-04-11
US15095750
Physics

Magnetic head for perpendicular magnetic recording including a coil for individually driving a main pole and a yoke

#3 | 2015-12-22 ✅ Patent 9,218,835 granted on 2015-12-22
US14475090
Physics

Thermally-assisted magnetic recording head including a heat sink

#4 | 2015-12-22 ✅ Patent 9,218,827 granted on 2015-12-22
US14335528
Physics

Thermally-assisted magnetic recording head including a return path section

#5 | 2012-12-13 ✅ Patent 8,358,015 granted on 2013-01-22
US20120313260A1
Electricity

Layered chip package and method of manufacturing same

#6 | 2012-10-11 ✅ Patent 8,344,494 granted on 2013-01-01
US20120256321A1
Electricity

Layered chip package and method of manufacturing same

#7 | 2012-07-05 ✅ Patent 8,358,487 granted on 2013-01-22
US20120170154A1
Physics

Thin-film magnetic head having coil of varying thinknesses in spaces adjacent the main magnetic pole

#8 | 2011-09-01 ✅ Patent 8,366,948 granted on 2013-02-05
US20110210095A1
Physics

Method of manufacturing near-field light generating element and method of manufacturing heat-assisted magnetic recording head

#9 | 2011-08-04 ✅ Patent 8,298,862 granted on 2012-10-30
US20110189822A1
Electricity

Method of manufacturing layered chip package

#10 | 2011-08-04 ✅ Patent 8,012,802 granted on 2011-09-06
US20110189820A1
Electricity

Method of manufacturing layered chip package

#11 | 2011-03-10 ✅ Patent 8,406,089 granted on 2013-03-26
US20110058273A1
Physics

Heat-assisted magnetic recording head with laser diode fixed to slider

#12 | 2011-01-20 ✅ Patent 8,395,971 granted on 2013-03-12
US20110013497A1
Physics

Heat-assisted magnetic recording head with laser diode fixed to slider

#13 | 2010-06-24 ✅ Patent 8,230,577 granted on 2012-07-31
US20100154198A1
Physics

Method of making a sensing unit

#14 | 2008-12-25 ✅ Patent 7,951,415 granted on 2011-05-31
US20080317969A1
Physics

Method of manufacturing magnetic head for perpendicular magnetic recording

#15 | 2008-11-06 ✅ Patent 7,910,160 granted on 2011-03-22
US20080274271A1
Physics

Thin-film magnetic head structure adapted to manufacture a thin-film head having a base magnetic pole part, a york magnetic pole part, and an intervening insulative film

#16 | 2008-10-16 ✅ Patent 7,921,544 granted on 2011-04-12
US20080254208A1
Physics

Method of manufacturing a thin film magnetic head structure

#17 | 2007-05-31 ✅ Patent 7,508,629 granted on 2009-03-24
US20070121248A1
Physics

Magnetic head for perpendicular magnetic recording that has a structure to suppress protrusion of an end portion of a shield layer resulting from heat generated by a coil, and method of manufacturing same

AssigneeID:

414261 ⎘