Megica Corp.

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2008-02-21

Patent Grants:

Last grant date:

2009-04-21

Top Inventors for applications by Megica Corp.

These are the the leading inventors for applications assigned to Megica Corp.:

Chien-Kang Chou 2 Tainan Hsien, Taiwan
Jin-Yuan Lee 1 Hsin-Chu, China
Ying-Chih Chen 1 Yung-Kong City, China
Ying-Chih Chen 1 Yung-Kong, China

Michael Chen 1 Tainan, Taiwan
Mark Chou 1 Kaohsiung, Taiwan
Mark Chou 1 Kaoshiang City, Taiwan
Chiu-Ming Chou 1 Kao-hsiung, Taiwan

Mou-Shiung Lin 1 Hsinchu, Taiwan
Mou-Shiung Lin 1 Hsin-Chu, China
Mou-Shiung Lin 1 Hsin-Chu, Taiwan
Michael Chen 1 Yung Kong City, Taiwan

Recent patent applications by Megica Corp.

Megica Corp. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-02-21 ✅ Patent 7,521,805 granted on 2009-04-21

US20080042297A1

Electricity

Post passivation interconnection schemes on top of the IC chips

#2 | 2007-11-01 ✅ Patent 7,554,208 granted on 2009-06-30

US20070252281A1

Electricity

Wirebond pad for semiconductor chip or wafer

#3 | 2007-07-19 ✅ Patent 7,521,812 granted on 2009-04-21

US20070164452A1

Electricity

Method of wire bonding over active area of a semiconductor circuit

AssigneeID:

415084 ⎘