, Delaware
United States
7
2010-07-22
7
2010-12-07
These are the the leading inventors for applications assigned to Fairchild Semiconductor Corporation:
Fairchild Semiconductor Corporation based in , US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Multi-chip semiconductor package
#2 | 2009-11-05 ✅ Patent 7,843,048 granted on 2010-11-30Multi-chip discrete devices in semiconductor packages
#3 | 2009-10-22 ✅ Patent 7,655,539 granted on 2010-02-02Dice by grind for back surface metallized dies
#4 | 2009-05-07 ✅ Patent 7,825,501 granted on 2010-11-02High bond line thickness for semiconductor devices
#5 | 2008-12-04 ✅ Patent 7,777,172 granted on 2010-08-17Methods for reducing cross talk in optical sensors
#6 | 2008-02-14 ✅ Patent 7,579,680 granted on 2009-08-25Packaging system for semiconductor devices
#7 | 2008-01-29 ✅ Patent 7,323,361 granted on 2008-01-29Packaging system for semiconductor devices
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