Assignee profile:

UNIVERSAL INSTRUMENTS CORPORATION

City:

Conklin, New York

Country:

United States

Published Applications:

26

Last publication date:

2021-02-25

Patent Grants:

24

Last grant date:

2022-08-09

Top Inventors for applications by UNIVERSAL INSTRUMENTS CORPORATION

These are the the leading inventors for applications assigned to UNIVERSAL INSTRUMENTS CORPORATION:

Recent patent applications by UNIVERSAL INSTRUMENTS CORPORATION

UNIVERSAL INSTRUMENTS CORPORATION based in Conklin, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2021-02-25 ✅ Patent 11,412,646 granted on 2022-08-09
US20210059087A1
Electricity

Spindle bank, pick-and-place machine and method of assembly

#2 | 2021-01-07 ✅ Patent 11,464,146 granted on 2022-10-04
US20210007253A1
Electricity

Dispensing head, nozzle and method

#3 | 2020-12-31 ✅ Patent 11,464,147 granted on 2022-10-04
US20200413580A1
Electricity

Spindle module, pick-and-place machine and method of assembly

#4 | 2020-12-31 ✅ Patent 11,457,549 granted on 2022-09-27
US20200407176A1
Performing operations; transporting

Spindle module, bank, and method

#5 | 2020-12-17 ✅ Patent 11,903,137 granted on 2024-02-13
US20200396876A1
Electricity

Clinch mechanism for assembling a printed circuit board with electronic components

#6 | 2020-11-26 ✅ Patent 11,382,248 granted on 2022-07-05
US20200375074A1
Electricity

Dispensing head

#7 | 2020-11-26 ✅ Patent 11,375,651 granted on 2022-06-28
US20200369479A1
Performing operations; transporting

Dispensing head, nozzle and method

#8 | 2020-11-05 ✅ Patent 11,363,725 granted on 2022-06-14
US20200352036A1
Electricity

Fixture to hold part before and after reflow, and method

#9 | 2020-09-24 ✅ Patent 11,156,993 granted on 2021-10-26
US20200301404A1
Physics

Semiconductor die offset compensation variation

#10 | 2020-08-13 ✅ Patent 11,412,650 granted on 2022-08-09
US20200260620A1
Electricity

Lead tip illumination device, system, and method

#11 | 2020-06-25 ✅ Patent 11,363,748 granted on 2022-06-14
US20200205322A1
Electricity

Printed circuit board transport

#12 | 2020-02-13 ✅ Patent 11,358,247 granted on 2022-06-14
US20200047298A1
Performing operations; transporting

Nozzle changer, system, and related method

#13 | 2019-08-15 ✅ Patent 11,164,765 granted on 2021-11-02
US20190252220A1
Electricity

Modular die handling system

#14 | 2019-06-20 ✅ Patent 11,044,841 granted on 2021-06-22
US20190191607A1
Electricity

Feeder system, pick and place machine, and method

#15 | 2019-05-30 ✅ Patent 11,044,814 granted on 2021-06-22
US20190166697A1
Electricity

Method of assembly

#16 | 2019-05-09 ✅ Patent 10,893,638 granted on 2021-01-12
US20190141868A1
Electricity

Dispensing head having a nozzle heater device, system and method

#17 | 2017-07-06 ✅ Patent 9,951,449 granted on 2018-04-24
US20170191200A1
Textiles; paper

Sewing machine, system and method

#18 | 2017-05-11 ✅ Patent 10,189,654 granted on 2019-01-29
US20170129717A1
Performing operations; transporting

Test device for establishing, verifying, and/or managing accuracy

#19 | 2015-08-13 ✅ Patent 9,955,618 granted on 2018-04-24
US20150230369A1
Electricity

Pick and place head with internal vaccum and air pressure supply, system and method

#20 | 2015-06-25 ✅ Patent 9,814,170 granted on 2017-11-07
US20150181779A1
Electricity

Flexible assembly machine, system and method

#21 | 2015-06-18 ✅ Patent 9,918,419 granted on 2018-03-13
US20150173259A1
Electricity

Flexible assembly machine, system and method

#22 | 2015-06-18 ✅ Patent 10,058,018 granted on 2018-08-21
US20150173204A1
Electricity

Flexible assembly machine, system and method

#23 | 2015-06-18 ✅ Patent 10,052,705 granted on 2018-08-21
US20150165537A1
Performing operations; transporting

3D TSV assembly method for mass reflow

#24 | 2013-10-17
US20130269184A1
Electricity

PICK AND PLACE NOZZLE

#25 | 2012-08-30
US20120218402A1
Electricity

COMPONENT PLACEMENT PROCESS AND APPARATUS

#26 | 2012-06-21 ✅ Patent 8,898,893 granted on 2014-12-02
US20120152358A1
Electricity

Method and apparatus for applying fluid during a placement cycle

Also check out UNIVERSAL INSTRUMENTS CORPORATION's (Conklin, United States) applicant profile with 24 patent applications submitted.

AssigneeID:

42239 ⎘