ASM Assembly Materials Ltd.

City:

Hong Kong

Country:

Hong Kong

Published Applications:

Last publication date:

2008-09-25

Patent Grants:

Last grant date:

2010-04-06

Top Inventors for applications by ASM Assembly Materials Ltd.

These are the the leading inventors for applications assigned to ASM Assembly Materials Ltd.:

Chi Chung LEE 2 Hong Kong, Hong Kong
Yiu Fai KWAN 2 Hong Kong, Hong Kong
Tat Chi CHAN 2 Hong Kong, Hong Kong
Chun Ho YAU 1 Hong Kong, Hong Kong

Wai CHAN 1 Hong Kong, Hong Kong

Recent patent applications by ASM Assembly Materials Ltd.

ASM Assembly Materials Ltd. based in Hong Kong, HK has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-09-25 ✅ Patent 7,691,679 granted on 2010-04-06

US20080233683A1

Electricity

Pre-plated leadframe having enhanced encapsulation adhesion

#2 | 2008-09-11 ✅ Patent 8,012,886 granted on 2011-09-06

US20080216921A1

Chemistry; metallurgy

Leadframe treatment for enhancing adhesion of encapsulant thereto

AssigneeID:

425164 ⎘