Tessonics Corp.

City:

Birmingham, Michigan

Country:

United States

Published Applications:

Last publication date:

2023-01-26

Patent Grants:

Last grant date:

2025-06-24

Top Inventors for applications by Tessonics Corp.

These are the the leading inventors for applications assigned to Tessonics Corp.:

Roman Gr. Maev 2 Windsor, Canada
Roman Grigorievich Maev 1 Windsor, Canada
Andrew Ouellette 1 Windsor, Canada
Jeffrey T. Sadler 1 Chatham, Canada

Eugene Malyarenko 1 Troy, MI United States
Andriy Chertov 1 Windsor, Canada
Sergey Aleksandrovich Titov 1 Moscow, Russian Federation
Alexey Nikolaevich Bogachenkov 1 Moscow, Russian Federation

Recent patent applications by Tessonics Corp.

Tessonics Corp. based in Birmingham, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2023-01-26 ✅ Patent 12,337,419 granted on 2025-06-24

US20230029143A1

Performing operations; transporting

ULTRASONIC MICRO-ARRAY IMAGING SYSTEM

#2 | 2013-10-31 ✅ Patent 9,933,397 granted on 2018-04-03

US20130289895A1

Physics

Method and system for assessing the quality of adhesively bonded joints using ultrasonic waves

#3 | 2013-10-17 ✅ Patent 9,613,401 granted on 2017-04-04

US20130272597A1

Physics

Method to obtain 3D images of a flowing region beneath an object using speckle reflections

Also check out Tessonics Corp.'s (Birmingham, United States) applicant profile with 4 patent applications submitted.

AssigneeID:

42563 ⎘