Apprecia Technology Inc.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2008-04-17

Patent Grants:

Last grant date:

2011-06-21

Top Inventors for applications by Apprecia Technology Inc.

These are the the leading inventors for applications assigned to Apprecia Technology Inc.:

Haruru Watatsu 2 Okayama-shi, Japan
Nobuhiko Izuta 2 Okayama-shi, Japan
Nobuhiko Izuta 2 Okayama, Japan
Haruru Watatsu 2 Okayama, Japan

Hideo Yata 1 Nakano-ku, Japan

Recent patent applications by Apprecia Technology Inc.

Apprecia Technology Inc. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-04-17 ✅ Patent 7,964,108 granted on 2011-06-21

US20080087645A1

Chemistry; metallurgy

Regeneration method of etching solution, an etching method and an etching system

#2 | 2006-11-23 ✅ Patent 7,713,478 granted on 2010-05-11

US20060263251A1

Electricity

Equipment and method for measuring silicon concentration in phosphoric acid solution

AssigneeID:

426454 ⎘