Japan
5
2010-12-02
5
2012-06-19
These are the the leading inventors for applications assigned to Kabushiki Kaisha Nihon Micronics:
Kabushiki Kaisha Nihon Micronics based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Stacked package and method for forming stacked package
#2 | 2010-11-18 ✅ Patent 8,278,965 granted on 2012-10-02Inspection apparatus
#3 | 2010-05-13 ✅ Patent 7,946,855 granted on 2011-05-24Contact and electrical connecting apparatus
#4 | 2010-01-21 ✅ Patent 7,936,058 granted on 2011-05-03Stacked package and method for forming stacked package
#5 | 2008-09-18 ✅ Patent 7,719,300 granted on 2010-05-18Method for testing a semiconductor wafer and apparatus thereof
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