Brunei Darussalam
20
2015-03-12
20
2015-10-27
These are the the leading inventors for applications assigned to Neobulb Technologies, Inc.:
Neobulb Technologies, Inc. based in , BN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same
#2 | 2014-10-16 ✅ Patent 8,916,888 granted on 2014-12-23LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same
#3 | 2011-09-22 ✅ Patent 8,267,545 granted on 2012-09-18Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module
#4 | 2011-08-04 ✅ Patent 8,206,010 granted on 2012-06-26Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
#5 | 2010-08-12 ✅ Patent 8,226,272 granted on 2012-07-24Illuminating equipment using high power LED with high efficiency of heat dissipation
#6 | 2010-08-05 ✅ Patent 8,070,318 granted on 2011-12-06Light-emitting diode cluster lamp
#7 | 2010-08-05 ✅ Patent 7,988,341 granted on 2011-08-02Outdoor high powder light-emitting diode illuminating equipment
#8 | 2010-05-27 ✅ Patent 8,193,553 granted on 2012-06-05Semiconductor high-power light-emitting module with heat isolation
#9 | 2010-05-13 ✅ Patent 8,235,562 granted on 2012-08-07Light-emitting diode illumination apparatus
#10 | 2009-11-12 ✅ Patent 7,891,837 granted on 2011-02-22System in package high power highly efficient diode lamp
#11 | 2009-10-22 ✅ Patent 7,997,766 granted on 2011-08-16Light-emitting display panel
#12 | 2009-10-15 ✅ Patent 7,922,361 granted on 2011-04-12Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
#13 | 2009-10-01 ✅ Patent 7,976,197 granted on 2011-07-12Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
#14 | 2009-09-10 ✅ Patent 7,963,678 granted on 2011-06-21Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module
#15 | 2009-05-21 ✅ Patent 7,895,747 granted on 2011-03-01Method for manufacturing a heat pipe with a planished end surface
#16 | 2009-04-23 ✅ Patent 7,777,237 granted on 2010-08-17Semiconductor light-emitting device and method of fabricating the same
#17 | 2008-10-09 ✅ Patent 7,722,217 granted on 2010-05-25Light-emitting diode cluster lamp
#18 | 2008-08-14 ✅ Patent 7,896,527 granted on 2011-03-01Light-emitting diode illuminating equipment with replaceable shell
#19 | 2008-08-14 ✅ Patent 7,878,687 granted on 2011-02-01Light-emitting diode illuminating equipment
#20 | 2008-01-10 ✅ Patent 7,741,650 granted on 2010-06-22Illuminating equipment of high-power and clustered light-emitting diodes coupled to high efficiency heat-spreading and heat-dissipating module
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