Germany
3
2012-09-13
3
2014-06-03
These are the the leading inventors for applications assigned to Pac Tech—Packaging Technologies GmbH:
Pac Tech—Packaging Technologies GmbH based in , DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Diode array and method for producing a diode array
#2 | 2010-03-04 ✅ Patent 7,926,699 granted on 2011-04-19Method and device for transferring a solder deposit configuration
#3 | 2008-12-11 ✅ Patent 7,762,446 granted on 2010-07-27Method and device for transferring a solder deposit configuration
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