Ableprint Technology Co., Ltd.

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2025-08-07

Patent Grants:

Last grant date:

2026-05-26

Top Inventors for applications by Ableprint Technology Co., Ltd.

These are the the leading inventors for applications assigned to Ableprint Technology Co., Ltd.:

Chih-Horng Horng 3 Hsinchu, Taiwan
Chih-Horng Horng 2 Hsinchu City, Taiwan
Horng Chih Horng 2 Hsinchu, Taiwan
Shu-Hui Hung 1 Hsinchu City, Taiwan

HORNG CHIH HORNG 1 HSINCHU CITY, Taiwan
Yu-Cheng Chen 1 Miaoli, Taiwan
Yu-Cheng Chen 1 Miaoli City, Taiwan
Cheng-En Yang 1 Taichung, Taiwan

HORNG CHIH HORNG 1 HSINCHU CITY 300, Taiwan
Chun-hua LI 1 Hsinchu, Taiwan
Shu-Hui Hung 1 Hsinchu, Taiwan

Recent patent applications by Ableprint Technology Co., Ltd.

Ableprint Technology Co., Ltd. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-08-07

US20250254758A1

Electricity

FOREIGN OBJECT REMOVAL APPARATUS FOR PACKAGED ELECTRONIC COMPONENTS, AND ANOMALY CONTROL METHOD THEREOF

#2 | 2025-02-13 ✅ Patent 12,636,724 granted on 2026-05-26

US20250050440A1

Performing operations; transporting

METHOD OF CLEANING A BOTTOM PLATE

#3 | 2013-09-19 ✅ Patent 9,196,600 granted on 2015-11-24

US20130240115A1

Electricity

Device and method for chip pressing

#4 | 2013-06-20 ✅ Patent 8,893,378 granted on 2014-11-25

US20130152363A1

Electricity

Method for securing a carrier by gas pressurization to inhibit warpage of the carrier

#5 | 2013-03-14 ✅ Patent 8,936,968 granted on 2015-01-20

US20130065362A1

Electricity

Flip chip package manufacturing method

#6 | 2013-02-14 ✅ Patent 8,695,623 granted on 2014-04-15

US20130037126A1

Physics

Gas concentration control device for pressure vessel

#7 | 2009-05-14 ✅ Patent 7,863,094 granted on 2011-01-04

US20090124044A1

Electricity

Method for removing bubbles from adhesive layer of semiconductor chip package

AssigneeID:

435084 ⎘