Bondustry Oy

City:

Helsinki

Country:

Finland

Published Applications:

Last publication date:

2008-12-25

Patent Grants:

Last grant date:

2011-02-08

Top Inventors for applications by Bondustry Oy

These are the the leading inventors for applications assigned to Bondustry Oy:

Samuli Orko 1 Helsinki, Finland
Tero Liimatainen 1 Helsinki, Finland

Recent patent applications by Bondustry Oy

Bondustry Oy based in Helsinki, FI has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-12-25 ✅ Patent 7,883,122 granted on 2011-02-08

US20080315023A1

Performing operations; transporting

Device and method for forming elongated material

AssigneeID:

436152 ⎘