Assignee profile:

ZHEN DING TECHNOLOGY CO., LTD.

City:

Tayuan

Country:

Taiwan

Published Applications:

39

Last publication date:

2015-02-05

Patent Grants:

23

Last grant date:

2016-05-31

Top Inventors for applications by ZHEN DING TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to ZHEN DING TECHNOLOGY CO., LTD.:

Recent patent applications by ZHEN DING TECHNOLOGY CO., LTD.

ZHEN DING TECHNOLOGY CO., LTD. based in Tayuan, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-02-05 ✅ Patent 9,357,631 granted on 2016-05-31
US20150034364A1
Electricity

Flexible printed circuit board and method for making same

#2 | 2014-12-25
US20140374153A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#3 | 2014-12-04
US20140353006A1
Electricity

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#4 | 2014-10-16 ✅ Patent 9,210,811 granted on 2015-12-08
US20140305683A1
Electricity

Compact rigid-flexible printed circuit board and method for manufacturing same

#5 | 2014-10-09 ✅ Patent 9,099,450 granted on 2015-08-04
US20140300009A1
Electricity

Package structure and method for manufacturing same

#6 | 2014-07-03 ✅ Patent 9,730,328 granted on 2017-08-08
US20140185257A1
Electricity

Printed circuit board with embedded component and method for manufacturing same

#7 | 2014-07-03 ✅ Patent 9,072,173 granted on 2015-06-30
US20140182900A1
Electricity

Rigid-flex printed circuit board and method for making same

#8 | 2014-07-03
US20140182899A1
Electricity

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#9 | 2014-06-26 ✅ Patent 8,941,227 granted on 2015-01-27
US20140175646A1
Electricity

Package structure and method for manufacturing same

#10 | 2014-06-12
US20140158410A1
Electricity

POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARD

#11 | 2014-06-12
US20140158407A1
Electricity

PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACES

#12 | 2014-06-05
US20140151092A1
Electricity

PCB WITH VISIBLE CIRCUIT AND METHOD FOR MAKING AND USING PCB WITH VISIBLE CIRCUIT

#13 | 2014-05-29 ✅ Patent 9,288,914 granted on 2016-03-15
US20140144685A1
Electricity

Method of manufacturing a printed circuit board with circuit visible

#14 | 2014-05-29
US20140144675A1
Electricity

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#15 | 2014-05-01 ✅ Patent 9,165,790 granted on 2015-10-20
US20140117553A1
Electricity

Packaging substrate, method for manufacturing same, and chip packaging body having same

#16 | 2014-04-24
US20140110152A1
Electricity

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#17 | 2014-03-27
US20140085833A1
Electricity

CHIP PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME

#18 | 2014-03-27 ✅ Patent 9,295,150 granted on 2016-03-22
US20140083757A1
Electricity

Method for manufacturing a printed circuit board

#19 | 2014-03-27 ✅ Patent 9,439,282 granted on 2016-09-06
US20140083744A1
Electricity

Method for manufacturing printed circuit board

#20 | 2014-03-20 ✅ Patent 9,357,647 granted on 2016-05-31
US20140078706A1
Electricity

Packaging substrate, method for manufacturing same, and chip packaging body having same

#21 | 2014-03-06 ✅ Patent 9,439,281 granted on 2016-09-06
US20140060902A1
Electricity

Method for manufacturing printed circuit board

#22 | 2014-02-27
US20140054079A1
Electricity

MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#23 | 2014-02-27 ✅ Patent 9,107,332 granted on 2015-08-11
US20140054075A1
Electricity

Method for manufacturing printed circuit board

#24 | 2014-02-27 ✅ Patent 9,107,311 granted on 2015-08-11
US20140054074A1
Electricity

Method for manufacturing printed circuit board

#25 | 2014-02-06
US20140036465A1
Electricity

PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING BODY HAVING SAME

#26 | 2014-01-30 ✅ Patent 9,066,431 granted on 2015-06-23
US20140027164A1
Electricity

Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible

#27 | 2013-12-26
US20130341073A1
Electricity

PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

#28 | 2013-12-05 ✅ Patent 9,015,936 granted on 2015-04-28
US20130318785A1
Electricity

Method for manufacturing IC substrate

#29 | 2013-11-28
US20130313002A1
Electricity

MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

#30 | 2013-10-31 ✅ Patent 8,647,518 granted on 2014-02-11
US20130284692A1
Electricity

Resin coated copper foil, method for manufacturing same and multi-layer circuit board

#31 | 2012-10-18 ✅ Patent 9,198,304 granted on 2015-11-24
US20120260501A1
Electricity

Method for manufacturing rigid-flexible printed circuit board

#32 | 2012-08-23
US20120211267A1
Electricity

PRINTED CIRCUIT BOARD SUBSTRATE

#33 | 2012-06-28 ✅ Patent 8,723,050 granted on 2014-05-13
US20120160554A1
Electricity

Multilayer printed circuit board and method for making same

#34 | 2012-06-28 ✅ Patent 8,567,468 granted on 2013-10-29
US20120160398A1
Performing operations; transporting

Apparatus and method for pressing printed circuit board

#35 | 2012-05-03
US20120103521A1
Chemistry; metallurgy

ETCHING APPARATUS WITH SUCTION MECHANISM

#36 | 2012-04-26
US20120097784A1
Performing operations; transporting

APPARATUS FOR TRANSPORTING FLEXIBLE PRINTED CIRCUIT BOARD STRIP

#37 | 2012-04-26 ✅ Patent 8,591,692 granted on 2013-11-26
US20120097326A1
Electricity

Method for manufacturing rigid-flexible printed circuit board

#38 | 2012-03-22 ✅ Patent 8,453,324 granted on 2013-06-04
US20120066903A1
Electricity

Method of manufacturing FPCB substrate

#39 | 2012-02-02 ✅ Patent 9,125,334 granted on 2015-09-01
US20120023744A1
Electricity

Method for manufacturing multilayer printed circuit board

AssigneeID:

43750 ⎘