ChipMOS Technologies

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2010-07-29

Patent Grants:

Last grant date:

2011-04-05

Top Inventors for applications by ChipMOS Technologies

These are the the leading inventors for applications assigned to ChipMOS Technologies:

Jiunheng Wang 1 Tainan County, Taiwan
Yu Tang Pan 1 Tainan County, Taiwan
GENG SHIN SHEN 1 Tainan County, Taiwan
Shih Wen Chou 1 Tainan County, Taiwan

Hui-Ping Liu 1 Tainan County, Taiwan
Cheng-Ting Wu 1 Tainan County, Taiwan

Recent patent applications by ChipMOS Technologies

ChipMOS Technologies based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2010-07-29 ✅ Patent 7,919,874 granted on 2011-04-05

US20100187692A1

Electricity

Chip package without core and stacked chip package structure

#2 | 2009-03-12 ✅ Patent 7,964,940 granted on 2011-06-21

US20090065913A1

Electricity

Chip package with asymmetric molding

#3 | 2007-01-30 ✅ Patent 7,170,160 granted on 2007-01-30

US11301860

Chip structure and stacked-chip package

AssigneeID:

438170 ⎘